blog About Study Enhances Copper Powder Quality Via Thiourea Control

In electrodeposition processes, achieving precise control over copper powder particle size and morphology remains a fundamental challenge for enhancing material performance. The introduction of thiourea (TU) as an efficient electrolyte additive presents an innovative solution to this longstanding problem.

Thiourea serves as a "structural modulator" during electrodeposition. Research demonstrates that fine-tuning thiourea concentrations can significantly alter copper deposition behavior. Its mechanism exhibits a distinct dual nature: within specific concentration ranges, thiourea displays pronounced depolarization effects that accelerate ion migration and deposition, while in other concentration intervals, it transitions to passivation effects that effectively inhibit excessive grain growth.

Critical technical data reveals that when thiourea concentration reaches 4×10⁻⁴ mol/L , the system generates a measurable limiting adsorption current. This threshold provides a theoretical foundation for industrial production—by maintaining this parameter, engineers can stabilize the electrodeposition process to consistently produce copper powder with uniform particle distribution and dense microstructure.

This additive concentration-gradient approach to microstructure control not only optimizes electrodeposition efficiency but also establishes new technical pathways for developing high-performance metal powder materials. The methodology represents a significant advancement in electrochemical process refinement, marking a crucial step toward precision manufacturing.